Besides already having secured a granted the first US and Taiwan patent, we are now delighted to announce that our second US patent has also been granted and that we have more patent applications in the pipeline.'ĭr. This technology has been proven for such different materials as Gallium Phosphide (GaP), Silicon (Si) and Tantalum Nitride (TaN) – all being critical materials to the semiconductor and optoelectronic industry. Dmitry Suyatin, CTO and co-founder of AlixLabs on the origin of the invention and R&D activities in Lund, he said, 'Our key technology is based on a surprising discovery that sidewalls act as a topographical mask in Atomic Layer Etch Processes. USA is one of the most important markets for leading-edge semiconductor manufacturing, a huge industrial and consumer market for the most advanced electronic products and hence crucial for AlixLabs to protect its innovative APS process by IP. The company is now pleased to announce the first granted a second patent in the USA. The method also makes it possible to manufacture tiny semiconductor components accurately and efficiently with manageable wafer fab equipment investments.

The method makes the components cheaper and less resource-intensive to manufacture and can open up a new path for a more sustainable mass production of electronic products. 13, 2022 /PRNewswire/ - AlixLabs from Lund, Sweden, has developed a new, innovative method for manufacturing semiconductor components with a high degree of packing, eliminating several steps in the semiconductor manufacturing process - Atomic Layer Etch Pitch Splitting (APS)*.

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